Substrate transporting device, substrate treating apparatus, and substrate transporting method

ABSTRACT

Disclosed is a substrate transporting device including a transport mechanism, a transport chamber, a first exhaust fan, and a controller. The transport mechanism is movable in parallel in a given direction. The transport chamber includes a first wall disposed on a first side of the given direction of the transport mechanism, and a plurality of transportation ports each used for moving the substrate between an exterior and an interior of the transport chamber. The first exhaust fan is disposed closer to the first wall than any of the transportation ports, and exhausts gas in the transport chamber outside the transport chamber. The controller performs control such that, when the transport mechanism moves toward the first wall in a first proximal area whose distance from the first wall is of a given value or less, an exhaust amount of the first exhaust fan is larger than that when the transport mechanism moves toward the first wall out of the first proximal area.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.15/077,310, filed Mar. 22, 2016, which claims the benefit of JapanesePatent Application No. 2015-072182, filed Mar. 31, 2015, the contents ofwhich are incorporated herein by reference.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present invention relates to a substrate transporting device fortransporting a substrate such as a semiconductor wafer, a glasssubstrate for photomask, a glass substrate for liquid crystal display,an optical disk substrate, and the like (hereinafter, simply referred toas a “substrate”), a substrate treating apparatus provided with thesubstrate transporting device for treating the substrate, and asubstrate transporting method for transporting the substrate.

2. Description of the Related Art

Japanese Unexamined Patent Publication No. 2001-93827A discloses aplurality of transporting devices, a fan filter unit, an exhaust fan,and a controller. The transporting devices are each movable vertically.The fan filter unit is disposed above the transporting devices. Theexhaust fan is disposed below the transporting devices. The controllercontrols the exhaust fan. When the transporting devices are moveddownward simultaneously, turbulent airflow is generated. At this time,the controller performs control to increase an exhaust amount of theexhaust fan for enhancing downflow of clean air. The enhanced downflowabsorbs the turbulent airflow. This prevents particles from enteringinto treatment units.

Japanese Unexamined Patent Publication No. 2009-076805A discloses atransport chamber, a transport mechanism, a gas supply fan, a gas supplyvalve, an exhaust fan, an exhaust valve, and a controller. The transportmechanism is disposed in the transport chamber so as to be movablevertically. The gas supply fan and the gas supply valve each supply gasto the transport chamber. The exhaust fan and the exhaust valve eachexhaust gas from the transport chamber. The controller controls the gassupply fan, the gas supply valve, the exhaust fan and exhaust valve foradjusting a speed of downflow in the transport chamber. When thetransport mechanism moves the substrate downward, the controllerperforms control such that a rate of downflow is higher than a speed atwhich the substrate is moved downward. Since the downflow is faster thanthe speed at which the substrate is moved downward, the downflow issupplied to a surface of the downward-moving substrate. Accordingly,this prevents particles from adhering to the surface of the substrate.

However, the example of the currently-used apparatus with suchconstructions has the following drawback. That is, even thecurrently-used example may achieve insufficient suppression of floatingparticles.

SUMMARY OF THE INVENTION

The present invention has been made regarding the state of the art notedabove, and its one object is to provide a substrate transporting device,a substrate treating apparatus, and a substrate transporting method thatallow satisfactory suppression of floating particles.

An Inventor has attained a finding that floating particles are likely tooccur at an end face of the transport chamber rather than the center ofthe transport chamber. Moreover, the Inventor has attained anotherfinding that particles readily flow to the outside of the transportchamber through transportation ports at the end face of the transportchamber. The transportation ports are each an opening used for movingthe substrate to the inside/outside of the transport chamber. Thetransport chamber is connected to a substrate container thataccommodates the substrate, a treating unit that treats the substrateand other transport chambers via the transporting ports. If theparticles flow into the substrate container from the transport chamber,the substrate container has difficulty in protecting the substratesuitably. Moreover, if the particles enter from the transport chamberinto the treating unit and/or the other transport chambers, the treatingunit and/or the other transport chambers have difficulty in high-qualitytreatment or transport of the substrate.

A first aspect of the present invention provides a substratetransporting device. The substrate transporting device includes atransport mechanism that is movable in parallel in a given direction andtransports a substrate, and a transport chamber that accommodates thetransport mechanism. The transport chamber includes a first walldisposed in a first side of the given direction relative to thetransport mechanism, and a plurality of transportation ports each usedfor moving the substrate between an exterior and an interior of thetransport chamber. The substrate transporting device includes a firstexhaust unit that is disposed closer to the first wall than any of thetransportation ports, and exhausts gas in the transport chamber outsidethe transport chamber, and a controller that controls the transportmechanism and the first exhaust unit. The controller performs controlsuch that, when the transport mechanism moves toward the first wall in afirst proximal area whose distance from the first wall is of a givenvalue or less, an exhaust amount of the first exhaust unit is largerthan that when the transport mechanism moves toward the first wall outof the first proximal area.

The first wall is separated from the transport mechanism in the firstside of the given direction. The first exhaust unit is disposed closerto the first wall than any of the transportation ports. Consequently,the first exhaust unit can exhaust gas at a position closer to the firstwall than any of the transportation ports to the exterior of thetransport chamber.

When the transport mechanism moves toward the first wall in the firstproximal area, the controller performs control such that the exhaustamount of the first exhaust unit becomes relatively large. That is, whenthe transport mechanism approaches the first wall in the first proximalarea, the exhaust amount of the first exhaust unit is relatively large.This allows the gas pushed by the transport mechanism against to thefirst wall to escape outside the transport chamber efficiently.Consequently, a speed of the gas pushed out from a region between thetransport mechanism and the first wall to the other region in thetransport chamber can be relieved suitably. As a result, this allowssuitable suppression of floating particles in the transport chamber.Especially, the first exhaust unit is disposed closer to the first wallthan any of the transportation ports. This allows suitable suppressionof floating particles around any of the transportation ports.Consequently, the particles in the transport chamber are prevented fromflowing outside the transport chamber through the transportation ports.

On the other hand, when the transport mechanism moves toward the firstwall outside the first proximal area, the controller performs controlsuch that an exhaust amount of the first exhaust unit becomes relativelysmall. That is, when the transport mechanism approaches the first walloutside the first proximal area, the exhaust amount of the first exhaustunit is relatively small. This allows more effective reduction inconsumption energy of the first exhaust unit while the floatingparticles are suppressed.

It is preferred in the first aspect of the present invention that thefirst exhaust unit exhausts at least an amount of gas pushed out by thetransport mechanism when the transport mechanism moves toward the firstwall in the first proximal area. That is, it is preferred that theamount of gas exhausted by the first exhaust unit is equal to or morethan that pushed out against the first wall by the transport mechanismwhen the transport mechanism approaches the first wall in the firstproximal area. Almost all the amount of gas, pushed against the firstwall by the transport mechanism, can escape from the first exhaust unitoutside the transport chamber. This allows more efficient suppression offloating particles in the transport chamber.

It is preferred in the first aspect of the present invention that thefirst exhaust unit is disposed on the first wall, and is disposed lowerin level than the transportation ports. Since the first exhaust unit isdisposed on the first wall, the gas pushed against the first wall by thetransport mechanism can be suitably exhausted outside the transportchamber. Moreover, since the first exhaust unit is disposed lower inlevel than any of the transportation ports, the first exhaust unitallows exhaust of the gas while no particle floats adjacent to thetransportation ports.

It is preferred in the first aspect of the present invention that thefirst proximal area is defined so as to contain the transport mechanismthat transports the substrate to one of the transportation ports that isthe closest to the first wall, and so as not to contain the transportmechanism that transports the substrate to the transportation portsother than the transportation port that is the closest to the firstwall. Accordingly, effective reduction in consumption energy of thefirst exhaust unit is obtainable while floating particles aresatisfactorily suppressed.

It is preferred in the first aspect of the present invention that thecontroller performs control such that the transport chamber has apositive pressure also when the transport mechanism moves toward thefirst wall in the first proximal area. More specifically, it ispreferred that the exhaust amount of the first exhaust unit iscontrolled such that the transport chamber has a positive pressure whenthe transport mechanism approaches the first wall in the first proximalarea. Consequently, this prevents gas with a low degree of cleannessfrom entering into the transport chamber from outside the transportchamber, leading to sufficient suppression of floating particles.

It is preferred in the first aspect of the present invention that thesubstrate transporting device further includes a gas supply unit thatsupplies gas to the transport chamber. The controller controls the gassupply unit. The controller performs control such that an exhaust amountof the first exhaust unit is smaller than a supply amount of the gassupply unit also when the transport mechanism moves toward the firstwall in the first proximal area. The transport chamber allowsmaintenance of the positive pressure even when the transport mechanismapproaches the first wall in the first proximal area. As a result, thisprevents a low degree of cleanness of gas from entering into thetransport chamber from outside the transport chamber, leading to moreefficient suppression of floating particles.

The following is preferred in the first aspect of the present invention.That is, the transport chamber includes a second wall disposed in asecond side of the given direction relative to the transport mechanism.The substrate transporting device includes a second exhaust unit that isdisposed closer to the second wall than any of the transportation ports,and exhausts gas in the transport chamber outside the transport chamber.The controller controls the second exhaust unit. The controller performscontrol such that, when the transport mechanism moves toward the secondwall in a second proximal area whose distance from the second wall is ofa given value or less, an exhaust amount of the second exhaust unit islarger than that when the transport mechanism moves toward the secondwall out of the second proximal area. The second wall is separated fromthe transport mechanism in the second side of the given direction. Whenthe transport mechanism approaches the second wall in the secondproximal area, the exhaust amount of the second exhaust unit isrelatively large. This allows the gas pushed against the second wall bythe transport mechanism to escape outside the transport chamberefficiently. Consequently, air pushed out from the area between thetransport mechanism and the second wall to the other area in thetransport chamber allows suitable prevention of floating particles.Especially, the second exhaust unit is disposed closer to the secondwall than any of the transportation ports. This allows suitablesuppression of floating particles around any of the transportationports. Consequently, the particles in the transport chamber areprevented from flowing outside the transport chamber through thetransportation ports. Moreover, when the transport mechanism approachesthe second wall outside the second proximal area, effective reduction inconsumption energy of the second exhaust unit is obtainable whilefloating particles are satisfactorily suppressed.

It is preferred in the first aspect of the present invention that thesecond exhaust unit exhausts at least an amount of gas pushed out by thetransport mechanism when the transport mechanism moves toward the secondwall in the second proximal area. That is, it is preferred that theamount of gas exhausted by the second exhaust unit is equal to or morethan that pushed against the second wall by the transport mechanism whenthe transport mechanism approaches the second wall in the secondproximal area. Almost all the amount of gas, pushed against the secondwall by the transport mechanism, can escape from the second exhaust unitoutside the transport chamber. This allows more efficient suppression offloating particles in the transport chamber.

It is preferred in the first aspect of the present invention that thesecond exhaust unit is disposed on the second wall, and is disposedlower in level than the transportation ports. Since the second exhaustunit is disposed on the second wall, the gas pushed by the transportmechanism against the second wall can be suitably exhausted outside thetransport chamber. Moreover, since the second exhaust unit is disposedlower in level than any of the transportation ports, the second exhaustunit allows exhaust of the gas while no particle floats adjacent to thetransportation ports.

It is preferred in the first aspect of the present invention that thesecond proximal area is defined so as to contain the transport mechanismthat transports the substrate to one of the transportation ports that isthe closest to the second wall, and so as not to contain the transportmechanism that transports the substrate to the transportation portsother than the transportation port that is the closest to the secondwall. Accordingly, effective reduction in consumption energy of thesecond exhaust unit is obtainable while floating particles aresatisfactorily suppressed.

It is preferred in the first aspect of the present invention that thecontroller performs control such that the transport chamber has apositive pressure also when the transport mechanism moves toward thesecond wall in the second proximal area. More specifically, it ispreferred that the exhaust amount of the second exhaust unit iscontrolled such that the transport chamber has a positive pressure whenthe transport mechanism approaches the second wall in the secondproximal area. Consequently, this prevents gas with a low degree ofcleanness from entering into the transport chamber from outside thetransport chamber, leading to sufficient suppression of floatingparticles.

It is preferred in the first aspect of the present invention that thesubstrate transporting device further includes a gas supply unit thatsupplies gas to the transport chamber. The controller controls the gassupply unit. The controller performs control such that the sum of anexhaust amount of the first exhaust unit and an exhaust amount of thesecond exhaust unit is smaller than a supply amount of the gas supplyunit also when the transport mechanism moves toward the second wall inthe second proximal area. The transport chamber allows maintenance ofthe positive pressure even when the transport mechanism approaches thesecond wall in the second proximal area. As a result, this prevents alow degree of cleanness of gas from entering into the transport chamberfrom outside the transport chamber, leading to more efficientsuppression of floating particles.

It is preferred in the first aspect of the present invention that thecontroller performs control such that the exhaust amount of the secondexhaust unit is smaller than a supply amount of the gas supply unit alsowhen the transport mechanism moves toward the second wall in the secondproximal area. The transport chamber allows maintenance of the positivepressure even when the transport mechanism approaches the second wall inthe second proximal area. As a result, this prevents a low degree ofcleanness of gas from entering into the transport chamber from outsidethe transport chamber, leading to more efficient suppression of floatingparticles.

It is preferred in the first aspect of the present invention that thecontroller performs control such that the exhaust amount of the secondexhaust unit is kept constant and the supply amount of the gas supplyunit is kept constant when the transport mechanism moves toward thefirst wall. This allows suppression of consumption energy of the secondexhaust unit and the gas supply unit.

It is preferred in the first aspect of the present invention that thegiven direction is a horizontal direction. This allows a suitablesubstrate transporting device with a transport mechanism that moves inparallel horizontally.

It is preferred in the first aspect of the present invention that thegiven direction is a vertical direction. This allows a suitablesubstrate transporting device with a transport mechanism that moves inparallel vertically.

It is preferred in the first aspect of the present invention that thetransport chamber is disposed adjacent to a mount table that places asubstrate container thereon that accommodates the substrates, and thetransport mechanism transports the substrates individually to thesubstrate container placed on the mount table through the transportationports. The substrate transporting device allows transportation of thesubstrates to and from the substrate container while suitably preventingparticles from entering into the substrate container from the transportchamber.

A second aspect of the present invention provides a substrate treatingapparatus. The substrate treating apparatus includes the substratetransporting device mentioned above, and a treating unit that performstreatment to the substrate.

The substrate treating apparatus according to the second aspect of thepresent invention allows suitable protection of the substrate fromparticles.

A third aspect of the present invention provides a substratetransporting method for moving a transport mechanism in parallel in atransport chamber, having a plurality of transportation ports formedtherein, toward a first wall of the transport chamber. The substratetransporting method includes a first proximal approaching step of movingthe transport mechanism toward the first wall in a first proximal areawhose distance from the first wall is of a given value or less, and afirst distal approaching step of moving the transport mechanism to thefirst wall out of the first proximal area. In the first proximalapproaching step and the first distal approaching step, a first exhaustunit disposed closer to the first wall than any of the transportationports exhausts gas in the transport chamber. An exhaust amount of thefirst exhaust unit is larger in the first proximal approaching step thanthat in the first distal approaching step.

The exhaust amount is relatively large in the first proximal approachingstep. Consequently, a speed of the gas can be relieved suitably that arepushed from an area between the transport mechanism and the first wallto the other area in the transport chamber. Moreover, the first exhaustunit is disposed closer to the first wall than any of the transportationports. Accordingly, this achieves suitable prevention of floatingparticles around any of the transportation ports.

In addition, the exhaust amount is relatively small in the first distalapproaching step. This achieves more efficient reduction in consumptionenergy of the first exhaust unit while floating particles aresuppressed.

For the purpose of illustrating the invention, there are shown in thedrawings several forms which are presently preferred, it beingunderstood, however, that the invention is not limited to the precisearrangement and instrumentalities shown.

FIG. 1 is a plan view of a substrate transporting device and a substratetreating apparatus according to one embodiment of the present invention.

FIG. 2 illustrates an interior of the substrate transporting device seenfrom a treating section.

FIG. 3 is a side view of a mount table and a substrate transportingdevice.

FIG. 4 is a block diagram of control of the substrate transportingdevice.

FIG. 5 illustrates an exhaust amount of first and second exhaust fansand a supply amount of a gas supply fan.

FIG. 6 illustrates first and second proximal areas.

FIG. 7 schematically illustrates a relationship between movement of atransport mechanism and a gas flow.

FIG. 8A illustrates a speed of gas pushed out from an area in acomparative example. FIG. 8B illustrates a speed of gas pushed out froman area in the present embodiment.

FIG. 9 illustrates a substrate transporting device according to onemodification of the present invention.

FIG. 10 illustrates an exhaust amount of a first exhaust fan and asupply amount of a gas supply fan according to the modification.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

FIG. 1 is a plan view of a substrate transporting device and a substratetreating apparatus according to one embodiment of the present invention.In each drawing, symbols “X” and “Y” denote horizontal directionsorthogonal to each other, and a symbol “Z” denotes a vertical direction(also referred to as a upward/downward direction).

The substrate treating apparatus 1 includes an indexer (hereinafter,referred to as an “ID section”) 3 and a treating section 5. The IDsection 3 and the treating section 5 are adjacent to each other.

The ID section 3 includes a mount table 11 and a substrate transportingdevice 13. The mount table 11 places a plurality of cassettes C in ahorizontal direction X. The cassettes C each accommodate a plurality ofsubstrates (e.g., semiconductor wafers) W. The substrate transportingdevice 13 transports a substrate W to the cassette C placed on the mounttable 11. The substrate transporting device 13 includes a transportchamber 15 and a transport mechanism 17. The transport chamber 15 isdisposed adjacent to the mount table 11. The transport mechanism 17 isaccommodated in the transport chamber 15. The transport mechanism 17 ismovable in parallel in the horizontal direction X (hereinafter, referredto as a “given direction X”). A receiver 19 is disposed between thesubstrate transport chamber 15 and the treating section 5 for placingthe substrate W thereon. The transport mechanism 17 is accessible to thecassettes C placed on the mount table 11, and is accessible to thereceiver 19. The cassette C is a non-limiting example of the substratecontainer in the present invention.

The treating section 5 includes a transport chamber 21 and a pluralityof treating units 23. The transport chamber 21 includes a transportmechanism 22 for transporting the substrate W. The transport mechanism22 is accessible to the receiver 19 and the treating units 23. Thetreating units 23 each perform treatment to the substrate W. Thetreatment to the substrate W may be a liquid treatment such as acleaning treatment, a resist application treatment, and a developingprocess, or may be a heat treatment such as heating and cooling.

Reference is now made to FIGS. 2 and 3 in addition to FIG. 1. FIG. 2illustrates an interior of the substrate transporting device 13 seenfrom the treating section 5. FIG. 3 is a side view of the mount tableand the substrate transporting device.

The transport chamber 15 includes a first wall 31, a second wall 32, anda ceiling 33. The first wall 31 is disposed on a first side of the givendirection X (hereinafter, referred to as a “first direction X(+)”) ofthe transport mechanism 17. That is, the first wall 31 is disposed inthe first direction X(+) relative to the transport mechanism 17. Thefirst wall 31 is separated from the transport mechanism 17 in the firstdirection X(+). The second wall 32 is disposed on a second side of thegiven direction X (hereinafter, referred to as an “second directionX(−)”) of the transport mechanism 17. That is, the second wall 32 isdisposed in the second direction X(−) relative to the transportmechanism 17. The second wall 32 is separated from the transportmechanism 17 in the second direction X(−). The ceiling 35 is disposed inan upward direction Z(+) of the transport mechanism 15.

The first wall 31 includes a first exhaust fan 41. The second wall 32includes a second exhaust fan 42. The first exhaust fan 41 and thesecond exhaust fan 42 each exhaust gas in the transport chamber 15outside the transport chamber 15. The first exhaust fan 41 is anon-limiting example of the first exhaust unit in the present invention.The second exhaust fan 42 is a non-limiting example of the secondexhaust unit in the present invention.

The ceiling 33 includes a gas supply fan 43. The gas supply fan 43supplies clean gas to the transport chamber 15. FIG. 2 schematicallyillustrate a gas flow F supplied from the gas supply fan 43. The gassupply fan 43 is a non-limiting example of the gas supply unit in thepresent invention.

The transport chamber 15 further includes a front wall 34, a rear wall35, and a floor 36. The front wall 34 is disposed between the mounttable 11 and the transport mechanism 17. The front wall 34 includes aplurality of transportation ports A1, A2, A3, and A4 for moving thesubstrates between the interior of the transport chamber 15 and theexterior of the transport chamber 15 (i.e., the cassettes C). The rearwall 35 is disposed between the transport mechanism 17 and the transportmechanism 22. The rear wall 35 includes a transportation port A5 formoving the substrates between the interior of the transport chamber 15and the exterior of the transport chamber 15 (i.e., the transportchamber 21). The receiver 19 is disposed in the transportation port A5.The floor 36 is disposed in a downward direction Z(−) of the transportmechanism 17. A rail 37 is disposed on the floor 36 for guiding thetransport mechanism 17 in the given direction X.

The transport mechanism 17 includes a base 45, a frame 46, a movabletable 47, a link mechanism 48, and a holder arm 49. The base 45 isslidably disposed on the rail 37. The frame 46 is mounted on the base45. The frame 46 includes a plane (i.e., a Y-Z plane) that is orthogonalto the given direction X and extends from the base 45 in the upwarddirection Z(+). The frame 46 holds the movable table 47 such that themovable table 47 is movable vertically. The movable table 47 holds aproximal end of the link mechanism 48 such that the link mechanism 48turns around a vertical axis. The link mechanism 48 expands andcontracts in the horizontal direction. The link mechanism 48 includes afront end attached to the holder arm 49. The holder arm 49 holds onesubstrate W.

The base 45 moves on the rail 37, whereby the transport mechanism 17 ismoved in parallel in the given direction X. That is, the base 45, theframe 46, the movable table 47, the link mechanism 48, and the holderarm 49 are integrally moved in parallel in the given direction X.Accordingly, the transport mechanism 17 moves toward a position wherethe substrate W is transported to the transportation ports A1 to A5individually. FIG. 2 illustrates the transport mechanism 17 thattransports the substrate W to the transportation port A1. At this time,the movable table 47 moves vertically, and the link mechanism 48 turnsand expands/contracts, whereby the holder arm 49 accesses the cassette Cthrough the transportation port A1.

The following describes arrangement of the first exhaust fan 41 and thesecond exhaust fan 42. The first exhaust fan 41 is disposed at aposition lower in level than any of the transportation ports A1, A2, A3,and A4. More specifically, the first exhaust fan 41 is disposed at aposition lower than a height position H at the lower ends of thetransportation ports A1 to A4 (see FIG. 2). In addition, the firstexhaust fan 41 is disposed lower in level than the transportation portA5. Similarly, the second exhaust fan 42 is disposed lower in level thanany of lower ends of the transportation ports A1 to A5.

In the present embodiment, the first exhaust fan 41 faces to thetransport mechanism 17 in the given direction X. More specifically, thefirst exhaust fan 41 faces to at least any of the base 45, the frame 46,the movable table 47, the link mechanism 48, and the holder arm 49. Inother words, assuming that a “range G” denotes an area where thetransport mechanism 17 (the entire of the base 45, the frame 46, themovable table 47, the link mechanism 48, and the holder arm 49) isprojected on the first wall 31 in the given direction X, the firstexhaust fan 41 is disposed in the range G. The range G corresponds to apart of the first wall 31 overlapping any of the base 45, the frame 46,the movable table 47, the link mechanism 48, and the holder arm 49 seenfrom the given direction X. Similarly, the second exhaust fan 42 facesto the transport mechanism 17.

Reference is made to FIG. 4. FIG. 4 is a block diagram of control of thesubstrate transporting device 13. The substrate transporting device 13includes a controller 50. The controller 50 controls the transportmechanism 17, the first exhaust fan 41, the second exhaust fan 42, andthe gas supply fan 43. The controller 47 includes a central processingunit (CPU), a RAM (Random-Access Memory) as a workspace of arithmeticprocessing, and a storage medium, such as a fixed disk, that storesvarious types of information, such as transportation recipes orprocessing recipes set in advance. The transportation recipes defineprocedures of operation of the transport mechanism 17.

The following simply describes a non-limiting example of operation ofthe substrate treating apparatus 1 according to the embodiment of thepresent invention. The transport mechanism 17 transports one substrate Wfrom the cassette C, and places the substrate W on the receiver 19. Thetransport mechanism 22 transports the substrate W placed on the receiver19 to the treating unit 23. The treating unit 23 performs treatment tothe substrate W. The transport mechanism 22 transports the substrate Wfrom the treating unit 23, and places the substrate W on the receiver19. The transport mechanism 17 transports the substrate W placed on thereceiver 19 into the cassette C. In this manner, a given treatment isperformed to the substrate W.

The following describes a non-limiting example of operation of thesubstrate transporting device 13. The controller 50 controls an exhaustamount (flow rate) of the first and second exhaust fans 41 and 42 aswell as a supply amount (flow rate) of the gas supply fan 43 inaccordance with a position and a travel direction of the transportmechanism 17.

FIG. 5 illustrates the exhaust amounts of the first exhaust fan 41 andthe exhaust fan 42 and the supply amount of the gas supply fan 43. Asillustrated in FIG. 5, operation of the transport mechanism 17 isclassified as modes M1 to M9 from the position and the travel directionof the transport mechanism 17.

The following describes in detail the modes M1 to M9.

Mode M1: the transport mechanism 17 is moved toward the first wall 31 inthe second proximal area D2.

Mode M2: the transport mechanism 17 is moved toward the first wall 31out of the first proximal area D1 and the second proximal area D2.

Mode M3: the transport mechanism 17 is moved toward the first wall 31 inthe first proximal area D1.

Mode M4: the transport mechanism 17 remains at rest in the firstproximal area D1.

Mode M5: the transport mechanism 17 is moved toward the second wall 32in the first proximal area D1.

Mode M6: the transport mechanism 17 is moved toward the second wall 32out of the first proximal area D1 and the second proximal area D2.

Mode M7: the transport mechanism 17 is moved toward the second wall 32in the second proximal area D2.

Mode M8: the transport mechanism 17 remains at rest in the secondproximal area D2.

Mode M9: the transport mechanism 17 remains at rest out of the firstproximal area D1 and the second proximal area D2.

Here, the position of the transport mechanism 17 is classified as threetypes as under in accordance with the first proximal area D1 and thesecond proximal area D2.

1. first proximal area D1

2. second proximal area D2

3. out of first proximal area D1 and second proximal area D2

The following describes a position of the transport mechanism 17 indetail. FIG. 6 illustrates the first proximal area D1 and the secondproximal area D2 in the present embodiment. FIG. 6 illustrates positionsof the transport mechanisms 17(A1) to 17(A5) by dotted lines whentransporting the substrate W to the transportation ports A1 to A5,respectively.

As illustrated, the first proximal area D1 and the second proximal areaD2 are each defined in advance within the transport chamber 15. In thepresent embodiment, the first proximal area D1 is an area whose distancefrom the first wall 31 in the given direction X is of a given value orless. The second proximal area D2 is an area whose distance from thesecond wall 32 in the given direction X is of a given value or less. Inthe present embodiment, the first proximal area D1 does not overlap thesecond proximal area D2.

Here, the given value that defines the first proximal area D1 may be ormay not be equal to the given value that defines the second proximalarea D2. It should be noted that the first proximal area D1 containsonly a part of a movable area of the transport mechanism 17, and thusdoes not contain the entire of the movable area of the transportmechanism 17. Similarly, the second proximal area D2 contains only apart of the movable area of the transport mechanism 17, and thus doesnot contain the entire of the movable area of the transport mechanism17.

In the present embodiment, the first proximal area D1 contains atransport mechanism 17(A1) that transports a substrate W to thetransportation port A1 closest to the first wall 31, and does notcontain the other transport mechanisms 17(A2) to 17(A5) that transportsubstrates W to the transportation ports A2 to A5, respectively, otherthan the transportation port A1. In other words, the first proximal areaD1 contains a position of the transport mechanism 17 when the transportmechanism 17 transports a substrate W to the transportation port A1, anddoes not contain any positions of the transport mechanism 17 when thetransport mechanism 17 transports substrates W to any of thetransportation ports A2 to A5.

In the present embodiment, the second proximal area D2 contains atransport mechanism 17(A4) that transports a substrate W to thetransportation port A4 closest to the second wall 32, and does notcontain the transport mechanisms 17(A1) to 17(A3) and 17(A5) thattransport substrates W to the transportation ports A1 to A3 and A5,respectively, other than the transportation port A4. In other words, thesecond proximal area D2 contains a position of the transport mechanism17 when the transport mechanism 17 transports a substrate W to thetransportation port A4, and does not contain any positions of thetransport mechanism 17 when the transport mechanism 17 transportssubstrates W to any of the transportation ports A1 to A3 and A5.

In the present embodiment, neither the first proximal area D1 nor thesecond proximal area D2 contains the transport mechanism 17(A2), 17(A3),and 17(A5) that transport substrates W to the transportation port A2,A3, and A5, respectively.

The transport mechanism 17 may entirely be used for classification ofthe position of the transport mechanism 17. For instance, when thetransport mechanism 17 is entirely disposed in the first proximal areaD1, it is determinable that the transport mechanism 17 is inside thefirst proximal area. When at least a part of the transport mechanism 17is not disposed within the first proximal area D1, it is determinablethat the transport mechanism 17 is outside the first proximal area D1.Alternatively, a particular site of the transport mechanism 17 may beused as a position of the transport mechanism 17 for classifying theposition of the transport mechanism 17. For instance, when the frame 46is disposed within the first proximal area D1, it is determinable thatthe transport mechanism 17 is inside the first proximal area D1. Forinstance, when the movable table 47 is disposed within the secondproximal area D2, it is determinable that the transport mechanism 17 isinside the second proximal area D2.

Moreover, a travel direction of the transport mechanism 17 is classifiedas three types as under.

1. the first direction X(+)

2. the second direction X(−)

3. no direction (i.e., at rest)

Here, the “first direction X(+)” corresponds to a direction in which thetransport mechanism 17 moves toward the first wall 31. The seconddirection X(−) corresponds to a direction in which the transportmechanism 17 moves toward the second wall 32. The “no direction (i.e. atrest)” is a condition in which transport mechanism 17 remains at rest.FIG. 5 schematically illustrates the travel direction of the transportmechanism 17 by arrows.

The controller 50 controls an exhaust amount of the first exhaust fan 41at a low flow rate Q1L in the modes M1, M2, and M4 to M9. The controller50 controls an exhaust amount of the first exhaust fan 41 at a high flowrate Q1H higher than the low flow rate Q1L in the mode M3. Thecontroller 50 controls an exhaust amount of the second exhaust fan 42 atthe low flow rate Q2L in the modes M1 to M6, M8, and M9, and controls anexhaust amount of the second exhaust fan 42 at a high flow rate Q2Hhigher than the low flow rate Q2L in the mode M7. The controller 50controls a supply amount of the gas supply fan 43 at a flow rate Q3 inall the modes M1 to M9.

The controller 50 performs the control as above, whereby the substratetransporting device 13 operates as under.

If the transport mechanism 17 is moved in the first direction X(+), thefirst exhaust fan 41 exhausts gas at the low flow rate Q1L (in the modesM1 and M2) when the transport mechanism 17 is outside the first proximalarea D1, and the first exhaust fan 41 starts to exhaust the gas at thehigh flow rate Q1H (in the mode M3) when the transport mechanism 17enters into the first proximal area D1. Then, when the transportmechanism 17 stops in the first proximal area D1, the first exhaust fan41 exhausts the gas at the low flow rate Q1L again (in the mode M4).During such a series of operation, the second exhaust fan 42 exhaustsgas at the low flow rate Q2L, and the gas supply fan 43 supplies gas atthe flow rate Q3. The modes M1 and M2 are one non-limiting example ofthe first distal approaching step in the present invention. The mode M3is one non-limiting example of the first proximal approaching step inthe present invention.

If the transport mechanism 17 moves toward the second direction X(−),the second exhaust fan 42 exhausts gas at the low flow rate Q2L (in themodes M5 and M6) when the transport mechanism 17 is outside the secondproximal area D2, and the second exhaust fan 42 starts to exhaust gas atthe high flow rate Q2H (in the mode M7) when the transport mechanism 17enters into the second proximal area D2. Then, when the transportmechanism 17 stops in the second proximal area D2, the second exhaustfan 42 exhausts the gas at the low flow rate Q2L again (in the mode M8).During such a series of operation, the first exhaust fan 41 exhausts gasat the low flow rate Q1L, and the gas supply fan 43 supplies gas at theflow rate Q3. The modes M5 and M6 are one non-limiting example of thesecond distal approaching step in the present invention. The mode M7 isone non-limiting example of the second proximal approaching step in thepresent invention.

As noted above, in the present embodiment, when the transport mechanism17 moves toward the first wall 31 in the first proximal area D1, thefirst exhaust fan 41 exhausts a larger amount of gas than that when thetransport mechanism 17 moves toward the first wall 31 outside the firstproximal area D1. Accordingly, particles can be prevented from floatingin the transport chamber 15. This effect is to be described in detailwith reference to drawings.

FIG. 7 schematically illustrates a relationship between movement of thetransport mechanism 17 and a gas flow. In FIG. 7, the transportmechanism 17 (i.e., the base 45, the frame 46, the movable table 47, thelink mechanism 48, and the holder arm 49) is schematically illustratedin one simple figure.

When the transport mechanism 17 moves from a position Pa to a positionPb in the first direction X(+), the transport mechanism 17 pushes gas.More specifically, when the transport mechanism 17 moves in parallel inthe first direction X(+), the base 45, the frame 46, the movable table47, the link mechanism 48, and the holder arm 49 are moved in parallelin the first direction X(+), thereby pushing gas within the transportchamber 15 against the first wall 31. The product of an area of therange G and a moving distance ΔL of the transport mechanism 17corresponds to a volume V of the gas pushed by the transport mechanism17. As mentioned above, the range G is obtained by projecting thetransport mechanism 17 (the entire of the base 45, the frame 46, themovable table 47, the link mechanism 48, and the holder arm 49) on thefirst wall 31 in the given direction X.

A part of the gas pushed by the transport mechanism 17 is exhaustedoutside from the transport chamber 15 through the first exhaust fan 41disposed on the first wall 31 (more strictly, the range G of the firstwall 31). The other part of gas pushed by the transport mechanism 17 ispushed out from a region R between the transport mechanism 17 and thefirst wall 31 to the other region outside of the transport chamber 15.The gas pushed out from the region R to the other region of thetransport chamber 15 circulates within the transport chamber 15. Here,the region R is enclosed with the transport mechanism 17 and the rangeG, and extends in the given direction X. FIG. 7 schematicallyillustrates a gas flow Fa exhausted by the first exhaust fan 41 outsideof the transport chamber 15, and a gas flow Fb pushed out from theregion R to the other region of the transport chamber 15. Asillustrated, the gas flow Fb travels from the region R to everydirection (e.g., upward Z(+), downward Z(−), frontward Y(+), rearwardY(−)).

Here, the gas pushed out from the region R to the region other than theregion R of the transport chamber 15 is denoted by “gas Fb”. Thefollowing describes the gas Fb. A speed of the gas Fb is generallydetermined from an amount of gas Fb and a surface area of the region R.It is now assumed that the transport mechanism 17 approaches the firstwall 31 and operation thereof is shifted to the modes M1, M2, and M3 inthis order. A surface area of the region R becomes smaller as thetransport mechanism 17 approaches closer to the first wall 31. If anamount of the gas Fb is constant throughout the modes M1, M2 and M3, aspeed of the gas Fb in the mode M2 is higher than the speed of the gasFb in the mode M1, and the speed of the gas Fb in the mode M3 is higherthan the speed of the gas Fb in the mode M2. However, in the presentembodiment, the exhaust amount of the first exhaust fan 41 in the modeM3 is larger than that in the modes M1 and M2, respectively.Accordingly, the amount of the gas Fb in the mode M3 is smaller than inthe modes M1 and M2, respectively. As a result, relieved speed-up of thegas Fb is obtainable in the mode M3.

FIG. 8A illustrates a speed of the gas pushed out from the region R tothe other region in the transport chamber 15 in the comparative example.FIG. 8B illustrates a speed of the gas pushed out from the region R tothe other region in the transport chamber 15 in the present embodiment.FIGS. 8A and 8B both include a horizontal axis that represents time.Operation is shifted to the modes M2, M3, and M4 as time elapses.

As illustrated in FIG. 8A, in the comparative example, the exhaustamount of the first exhaust fan 41 in the mode M3 is equal to that inthe mode M2. Specifically, the exhaust amount of the first exhaust fan41 is kept at the low flow rate Q1L from the mode M2 to the mode M3. Insuch a comparative example, the speed of the gas pushed out from theregion R significantly increases at the mode M3.

As illustrated in FIG. 8B, in the present embodiment, the exhaust amountof the first exhaust fan 41 in the mode M3 is larger than that in themode M2. Specifically, operation is shifted from the mode M2 to the modeM3, the exhaust amount of the first exhaust fan 41 increases from thelow flow rate Q1L to the high flow rate Q1H. Such a present embodimentachieves more reduction than the comparative example in speed of the gaspushed out from the region R to the region other than the region R intransport chamber 15 in the mode M3.

As noted above, the present embodiment allows effective suppression ofthe speed of the gas pushed out from the region R to the other region ofthe transport chamber 15, leading to elimination of turbulent flow orvortex flow within the transport chamber 15. As a result, particles canbe prevented from rolling up within the transport chamber 15.

Similarly, in the present embodiment, when the transport mechanism 17moves toward the second wall 32 in the second proximal area D2, theexhaust amount of the second exhaust fan 42 becomes larger than thatwhen the transport mechanism 17 moves toward the second wall 32 outsidethe second proximal area D2. This prevents floating particles within thetransport chamber 15.

It is preferred that the first exhaust fan 41 exhausts at least anamount of gas equal to that pushed by the transport mechanism 17 whenthe transport mechanism 17 moves toward the first wall 31 in the firstproximal area D1. In other words, it is preferred that the high flowrate Q1H is equal to or more than the amount of gas pushed by thetransport mechanism 17 in unit time in the mode M3. This allows exhaustof the gas pushed out by the transport mechanism 17 in the mode M3 tothe exterior of the transport chamber 15 almost entirely. As a result,the amount of gas pushed out from the region R to the other region ofthe transport chamber 15 is substantially zero, leading to sufficientreduction in speed of the gas pushed out from the region R to the otherregion of the transport chamber 15. Consequently, floating particles areavoidable.

Similarly, it is preferred that the second exhaust fan 42 exhausts atleast an amount of gas equal to that pushed out by the transportmechanism 17 when the transport mechanism 17 moves toward the secondwall 32 in the second proximal area D2. This allows avoidance offloating particles.

It is preferred that the transport chamber 15 has a positive pressurewhen the transport mechanism 17 moves toward the first wall 31 out ofthe first proximal area D1. For instance, the controller 50 may performcontrol such that the sum of the low flow rate Q1L of the first exhaustfan 41 and the low flow rate Q2L of the second exhaust fan 42 is smallerthan the flow rate Q3 of the gas supply fan 43. This allows a maintainedpositive pressure within the transport chamber 15, leading to preventionof particles from the exterior to the interior of the transport chamber15.

Alternatively, the transport chamber 15 may have a positive pressureintentionally also when the transport mechanism 17 moves toward thefirst wall 31 in the first proximal area D1. For instance, thecontroller 50 may control a value of the high flow rate Q1H such thatthe transport chamber 15 has a maintained positive pressure even whenthe transport mechanism 17 approaches the first wall 31. For instance,the controller 50 may perform control such that the sum of the high flowrate Q1H of the first exhaust fan 41 and the low flow rate Q2L of thesecond exhaust fan 42 is smaller than the flow rate Q3 of the gas supplyfan 43. This allows more sufficient prevention of gas with a low degreeof cleanness from entering from the exterior to the interior of thetransport chamber 15, leading to efficient elimination of floatingparticles.

Similarly, it is preferred that the transport chamber 15 has a positivepressure even when the transport mechanism 17 moves toward the secondwall 32 outside the second proximal area D2. This prevents the particlesfrom entering from the exterior to the interior of the transport chamber15.

Similarly, it is preferred that the transport chamber 15 has a positivepressure intentionally also when the transport mechanism 17 moves towardthe second wall 32 in the second proximal area D2. This allows moresufficient prevention of gas with a low degree of cleanness fromentering from the exterior to the interior of the transport chamber 15,leading to efficient elimination of floating particles.

Moreover, the high flow rate Q1H may be lower than the flow rate Q3 ofthe gas supply fan 43. This ensures a maintained positive pressure ofthe transport chamber 15, allowing prevention of a gas with a low degreeof cleanness from entering from exterior to the interior of thetransport chamber 15. Consequently, more efficient elimination offloating particles is obtainable. Similarly, the high flow rate Q2H maybe lower than the flow rate Q3 of the gas supply fan 43. This ensures amaintained positive pressure of the transport chamber 15, allowingprevention of a gas with a low degree of cleanness from entering fromthe exterior to the interior of the transport chamber 15. Consequently,more efficient elimination of floating particles is obtainable.

In the modes other than the mode M3, the first exhaust fan 41 exhaustsgas at the low flow rate Q1L. As mentioned above, since the speed of gaspushed out from the region R to the other region of the transportchamber 15 is lower in the modes M1 and M2 than in the mode M3,sufficient suppression of floating particles is obtainable even at thelow flow rate Q1L. In addition, reduction in power consumption of thefirst exhaust fan 41 is obtainable.

Similarly, in the modes other than the mode M7, the second exhaust fan42 exhausts gas at the low flow rate Q2L. Consequently, reduction inpower consumption of the second exhaust fan 42 is obtainable whilefloating particles are satisfactorily suppressed.

As mentioned above, the first exhaust fan 41 and the second exhaust fan42 each exhaust a relatively low amount of gas in almost the modes M1 toM9. Accordingly, the low flow rate Q3 of the gas supply fan 43 isobtainable, leading to reduction in power consumption of the gas supplyfan 43.

The first exhaust fan 41 is disposed closer to the first wall 31 thanany of the transportation ports A1 to A5. Consequently, the gas pushedout from the region R to the other region of the transport chamber 15can be prevented from flowing adjacent to the transportation ports A1 toA5. That is, not only the transportation ports to A2 to A5 but also thetransportation port A1, closest to the first wall 31, can be preventedfrom being subjected to high-speed airflow. As a result, floatingparticles around any of the transportation ports A1 to A5 are suitablysuppressed. Consequently, this prevents the particles from flowing fromthe interior to the exterior the transport chamber 15 (e.g., to thecassette C) through the transportation ports A1 to A5. Similarly, thesecond exhaust fan 42 is disposed closer to the second wall 32 than anyof the transportation ports A1 to A5. As a result, floating particlesaround any of the transportation ports A1 to A5 are suitably suppressed.Consequently, this prevents the particles from flowing from the interiorto the exterior of the transport chamber 15 through the transportationports A1 to A5.

The first exhaust fan 41 is disposed lower in level than thetransportation ports A1 to A5. Accordingly, the first exhaust unit 41causes no particle below the transportation ports A1 to A5 to moveupward to a level substantially equal to that of the transportationports A1 to A5. That is, the first exhaust unit does not float theparticles up to the level of the transportation ports A1 to A5.Moreover, the first exhaust unit 41 sucks no particles below thetransportation ports A1 to A5. As noted above, the first exhaust fan 41allows effective and appropriate exhaust of the gas in the region Rwhile an atmosphere around the transportation ports A1 to A5 is keptclean. Similarly, the second exhaust fan 42 is disposed lower in levelthan the transportation ports A1 to A5. Accordingly, the second exhaustunit 42 causes no particle below the transportation ports A1 to A5 toflow up to a level higher than the lower ends of the transportationports A1 to A5. This allows maintenance of cleaned atmosphere around thetransportation ports A1 to A5.

Moreover, the transportation ports A1 to A5 are disposed lower than thegas supply fan 43 and higher than the first exhaust fan 41. Accordingly,cleaned gas supplied from the gas supply fan 43 flows adjacent to thetransportation ports A1 to A5 (see FIG. 2). That is, the cleaned gassupplied from the gas supply fan 43 can be supplied around thetransportation ports A1 to A5 suitably. This allows maintenance of thecleaned atmosphere around the transportation ports A1 to A5. Similarly,the transportation port A1 to A5 are disposed in a height positionbetween the gas supply fan 43 and the second exhaust fan 42, leading tomaintenance of cleaned atmosphere around the transportation ports A1 toA5.

The first exhaust fan 41 faces to the transport mechanism 17, therebydirectly exhausting the gas in the region R. This allows effectivesuppression of the speed of the gas pushed out from the region R.Similarly, the second exhaust fan 42 faces to the transport mechanism17, thereby allowing effective suppression of the speed of the gaspushed out from the region between the transport mechanism 17 and thesecond wall 32.

The first proximal area D1 is defined so as to contain the transportmechanism 17 that transports the substrate W to the transportation portA1 closest to the first wall 31, and so as not to contain the transportmechanism 17 that transports the substrate W to the transportation portsA2 to A5 other than the transportation port A1. This allows effectivereduction in power consumption of the first exhaust fan 41 whilefloating particles are suppressed. Similarly, the second proximal areaD2 is defined so as to contain the transport mechanism 17 thattransports the substrate W to the transportation port A4 closest to thesecond wall 32, and so as not to contain the transport mechanism 17 thattransports the substrate W to the transportation port A1 to A3, and A5other than the transportation port A4. This allows effective reductionin power consumption of the second exhaust fan 42 while floatingparticles are suppressed.

The present invention is not limited to the above embodiments, but maybe modified as under.

(1) In the embodiments mentioned above, the substrate transportingdevice 13 includes the second exhaust fan 42. However, this is notlimitative. That is, the second exhaust fan 42 is omittable. Such amodification also achieves suitable elimination of floating particles.

(2) In the embodiments mentioned above, the controller 50 performscontrol so as to start decrease of the exhaust amount of the firstexhaust fan 41 to the low flow rate Q1L when the transport mechanism 17stops movement toward the first wall 31 in the first proximal area D1.However, this is not limitative. For instance, the controller 50 mayperform control so as to start decrease of the exhaust amount of thefirst exhaust fan 41 after a given period elapses from when thetransport mechanism 17 stops movement toward the first wall 31 in thefirst proximal area D1. Such a modification ensures more satisfactoryelimination of floating particles.

Similarly, in the embodiments mentioned above, the controller 50performs control so as to start decrease of the exhaust amount of thesecond exhaust fan 42 to the low flow rate Q2L when the transportmechanism 17 stops movement toward the second wall 32 in the secondproximal area D2. However, this is not limitative. For instance, thecontroller 50 may perform control so as to start decrease of the exhaustamount of the second exhaust fan 42 after a given period elapses fromwhen the transport mechanism 17 stops movement toward the second wall 32in the second proximal area D2. Such a modification also ensures moresatisfactory elimination of floating particles.

(3) In the embodiments mentioned above, the controller 50 may performcontrol so as to increase/decrease the high flow rate Q1H of the firstexhaust fan 41 in accordance with at least any the position, the speed,and the acceleration of the transport mechanism 17 when the transportmechanism 17 moves toward the first wall 31 in the first proximal areaD1. Such a modification allows control of the high flow rate Q1H inaccordance with the amount of gas pushed out by the transport mechanism17 from the region R, leading to more accurate suppression of floatingparticles.

Similarly, the controller 50 may perform control so as toincrease/decrease the high flow rate Q2H of the second exhaust fan 42 inaccordance with at least any of the position, the speed, and theacceleration of the transport mechanism 17 when the transport mechanism17 moves toward the second wall 32 in the second proximal area D2. Sucha modification also allows more accurate suppression of floatingparticles.

(4) In the embodiments mentioned above, the first exhaust fan 41 and thesecond exhaust fan 42 face to the transport mechanism 17. However, thisis not limitative. For instance, the first exhaust fan 41 may bedisposed out of the range G (e.g., below the range G). The secondexhaust fan 42 may be disposed in the same manner as above. Such amodification also achieves suitable suppression of floating particles.

(5) The embodiment mentioned above describes the first proximal area D1and the like in detail. However, this is not limitative. A position or arange of the first proximal area D1 is variable appropriately.Similarly, the position or the range of the second proximal area D2 isvariable appropriately. For instance, the first proximal area D1 may bedefined as under. That is, it may be assumed that the transportmechanism 17 is in the first proximal area D1 when the frame 46 of thetransport mechanism 17 is closer to the first wall 31 than to thetransportation port A1 closest to the first wall 31, and otherwise itmay be assumed that the transport mechanism 17 is outside the firstproximal area D1. In other words, a given value by which the firstproximal area D1 is defined may be a distance between the first wall 31and the transportation port A1 closest to the first wall 31.Alternatively, the frame 46 may be used as a positional reference of thetransport mechanism 17.

(6) In the embodiments mentioned above, the first exhaust fan 41 isdisposed on the first wall 31. However, this is not limitative. Thefirst exhaust fan 41 may be disposed on any of the ceiling 33, the frontwall 34, the rear wall 35, and the floor 36 when the first exhaust fan41 is closer to the first wall 31 than any of the transportation portsA1 to A5. Similarly, the second exhaust fan 42 is disposed on the secondwall 32. However, this is not limitative. The second exhaust fan 42 maybe disposed on any of the ceiling 33, the front wall 34, the rear wall35, and the floor 36 when the second exhaust fan 42 is closer to thesecond wall 32 than any of the transportation ports A1 to A5.

(7) In the embodiments mentioned above, the transport mechanism 17 ismovable in parallel in the given direction X. However, this is notlimitative. For instance, the transport mechanism 17 may be movable inparallel in the vertical direction Z.

Reference is made to FIG. 9. FIG. 9 illustrates a substrate transportingdevice 53 according to one modification of the present invention. In thefollowing, like numerals are used to identify like components which arethe same as in the embodiment, and the detailed description thereof isto be omitted. The substrate transporting device 53 includes a transportchamber 55 and a transport mechanism 57. The transport mechanism 57 isaccommodated in the transport chamber 55. The transport mechanism 57 ismovable in parallel in the vertical direction Z. Here, the verticaldirection Z is a non-limiting example of the given direction in thepresent invention.

The transport chamber 55 includes a ceiling 63, a front wall 64, a rearwall 65, and a floor 66. The floor 66 is disposed in the downwarddirection Z(−) of the transport mechanism 57. The ceiling 63 has an airsupply fan 43 attached thereto. The front wall 64 has a transportationport A11 formed therein. A receiver 19 is disposed in the transportationport A11. The substrate transporting device 53 is connected to anexternal apparatus (e.g., other transport chambers) via thetransportation port A11. The rear wall 65 includes a plurality oftreating units 23 arranged vertically. The treating units 23 includetransportation ports A12, A13, and A14 individually. The transportationport A14 is the closest to the floor 66 among the transportation portsA11 to A14. The floor 66 has a first exhaust fan 41 attached thereto.Moreover, the transport chamber 55 includes a rail 67 that guides thetransport mechanism 57 in the vertical direction Z. Here, the floor 66is one non-limiting example of the first wall in the present invention.

The transport mechanism 57 is movable in parallel in a verticaldirection (hereinunder, referred to as a “given direction”) Z. Thetransport mechanism 57 includes a movable table 77, a link mechanism 78,and a holder arm 79. The movable table 77 is slidably attached to therail 67. The movable table 77 includes an undersurface orthogonallyrelative to the given direction Z. The movable table 77 rotatably holdsthe link mechanism 78. The link mechanism 78 holds the holder arm 79.

The movable table 77 moves along the rail 67, whereby the transportmechanism 57 moves in parallel in the given direction Z. That is, themovable table 77, the link mechanism 78, and the holder arm 79 move inparallel integrally in the given direction Z. Accordingly, the transportmechanism 57 moves toward a position in which substrates W aretransported to transportation ports A11 to A14 individually.

The first proximal area D1 is defined so as to have a distance from thefloor 66 of a given value or less. The first proximal area D1 contains atransport mechanism 57 that transports a substrate W to thetransportation port A14, and does not contain the transport mechanism 57that transports substrates W to transportation ports A11 to A13individually other than the transportation port A14.

FIG. 10 illustrates an exhaust amount of the first exhaust fan 41 and asupply amount of air supply fan 43. As illustrated, operation of thetransport mechanism 17 is classified as six modes M11 to M16 dependingon a position and a travel direction of the transport mechanism 17. Morespecifically, the position of the transport mechanism 57 is classifiedas two types, i.e., the inside of a first proximal area D1 and theoutside of the first proximal area D1. Moreover, the travel direction ofthe transport mechanism 57 is classified as three types, i.e., adownward direction Z(−), an upward direction Z(+), and at rest. Here,the downward direction Z(−) is directed to the floor 66.

The following describes in detail modes M11 to M16.

Mode M11: the transport mechanism 17 moves toward the floor 66 out ofthe first proximal area D1.

Mode M12: the transport mechanism 17 moves toward the floor 66 in thefirst proximal area D1.

Mode M13: the transport mechanism 17 remains at rest in the firstproximal area D1.

Mode M14: the transport mechanism 17 moves in the upward direction Z(+)in the first proximal area D1.

Mode M15: the transport mechanism 17 moves toward the upward directionZ(+) out of the first proximal area D1.

Mode M16: the transport mechanism 17 remains at rest out of the firstproximal area D1.

The controller 50 controls an exhaust amount of the first exhaust fan 41to the low flow rate Q1L in the modes M11, and M13 to M16, and controlsthe exhaust amount of the first exhaust fan 41 to the high flow rate Q1Hhigher than the low flow rate Q1L in the mode M12. The controller 50maintains the supply amount of the gas supply fan 43 at a flow rate Q3in all the modes M11 to M16.

The controller 50 performs control as above, whereby the substratetransporting device 53 operates as under.

When the transport mechanism 57 moves in the downward direction Z(−),the first exhaust fan 41 exhausts gas at the low flow rate Q1L when thetransport mechanism 57 is disposed outside the first proximal area D1(in the mode M11). When the transport mechanism 57 enters into the firstproximal area D1, the first exhaust fan 41 starts to exhaust gas at thehigh flow rate Q1H (in the mode M12). Then, when the transport mechanism57 stops in the first proximal area D1, the first exhaust fan 41exhausts gas again at the low flow rate Q1L (in the mode M13). During aseries of such operation, the gas supply fan 43 supplies gas at the flowrate Q3. The mode M11 is one non-limiting example of the first distalapproaching step in the present invention. The mode M12 is onenon-limiting example of the first proximal approaching step in thepresent invention.

When the transport mechanism 57 moves in the upward direction Z(+), thefirst exhaust fan 41 exhausts gas at the low flow rate Q1L, and the gassupply fan 43 supplies gas at the flow rate Q3 regardless of theposition of the transport mechanism 57 (in the modes M14 and M15).

Such a modification allows suitable suppression of the increased speedof the gas pushed out from the region (see FIG. 9) between the transportmechanism 57 and the floor 66 to the other region of the transportchamber 55. Accordingly, this achieves effective elimination of floatingparticles.

Moreover, in the modification, the position of the first exhaust fan 41may be variable appropriately. For instance, the first exhaust fan 41may be disposed on at least either the front wall 64 or the rear wall65. Here, it is preferred that the first exhaust fan 41 is disposed at aposition closer to the floor 66 than any of the transportation ports A11to A14. This allows suitable prevention of particles from floatingaround the transportation ports A11 to 14 when transport mechanism 57approaches the floor 66 inside the first proximal area D1. Moreover,since the position closer to the floor 66 than any of the transportationports A11 to A14 is lower than any of the transportation ports A11 toA14, the transport mechanism 57 never causes particles to float up to aheight position of the transportation ports A11 to A14.

(8) In the embodiments mentioned above, the controller 50 controls thefirst exhaust fan 41 and the like in accordance with transportationrecipes set in advance. However, this is not limitative. For instance,the substrate transporting device 13 includes a sensor that detects atleast any of the position, the speed, and the acceleration of thetransport mechanism 17. The controller 50 controls the first exhaust fan41, the second exhaust fan 42, and the gas supply fan 43 based ondetection results by the sensor. Such may be adopted.

(9) In the embodiments mentioned above, the substrate transportingdevice 13 constitutes the ID section 3. However, this is not limitative.For instance, the substrate transporting device 13 is applicable to anelement that constitutes the treating section 5. Alternatively, thesubstrate transporting device 13 is applicable to an interface sectionthat is disposed between the exposing machine and the treating section 5for receiving and delivering the substrate W.

(10) In the embodiments mentioned above, the transport mechanism 17 isnot necessarily disposed in either the first proximal area D1 or thesecond proximal area D2. However, this is not limitative. That is, thefirst proximal area D1 and the second proximal area D2 may be definedsuch that the transport mechanism 17 is necessarily disposed in eitherthe first proximal area D1 or the second proximal area D2.

(11) In the embodiments mentioned above, the first proximal area D1 doesnot overlap the second proximal area D2 each other. However, this is notlimitative. For instance, the first proximal area D1 and the secondproximal area D2 may be defined so as to overlap each other partially.

(12) The present embodiments and the modifications in the above (1) to(11) may be variable appropriately by replacing or combining theelements of the present embodiments or the modifications with the otherthereof.

The present invention may be embodied in other specific forms withoutdeparting from the spirit or essential attributes thereof and,accordingly, reference should be made to the appended claims, ratherthan to the foregoing specification, as indicating the scope of theinvention.

What is claimed is:
 1. A substrate transporting device, comprising: atransport mechanism that is movable in parallel in a given direction andtransports a substrate; and a transport chamber that accommodates thetransport mechanism, the transport chamber comprising: a first walldisposed on a first side of the given direction of the transportmechanism; and a plurality of transportation ports each used for movingthe substrate between an exterior and an interior of the transportchamber, the substrate transporting device further comprising: a firstexhaust unit that is disposed closer to the first wall than any of thetransportation ports, and exhausts gas in the transport chamber outsidethe transport chamber, and a controller that controls the transportmechanism and the first exhaust unit, wherein the controller performscontrol such that, when the transport mechanism is located in a firstproximal area whose distance from the first wall is of a given value orless, and moves toward the first wall, an exhaust amount of the firstexhaust unit is larger than that when the transport mechanism is locatedout of the first proximal area, holds the substrate, and moves towardthe first wall.
 2. The substrate transporting device according to claim1, wherein the first exhaust unit exhausts at least an amount of gaspushed out by the transport mechanism when the transport mechanism movestoward the first wall in the first proximal area.
 3. The substratetransporting device according to claim 1, wherein the first exhaust unitis disposed on the first wall, and is disposed lower in level than thetransportation ports.
 4. The substrate transporting device according toclaim 1, wherein the first proximal area is defined so as to contain thetransport mechanism when the transport mechanism transports thesubstrate to one of the transportation ports that is the closest to thefirst wall, and so as not to contain the transport mechanism when thetransport mechanism transports the substrate to any of thetransportation ports other than the transportation port that is theclosest to the first wall.
 5. The substrate transporting deviceaccording to claim 1, wherein the controller performs control such thatthe transport chamber has a positive pressure also when the transportmechanism moves toward the first wall in the first proximal area.
 6. Thesubstrate transporting device according to claim 5, further comprising:a gas supply unit that supplies gas to the transport chamber, whereinthe controller controls the gas supply unit, and the controller performscontrol such that an exhaust amount of the first exhaust unit is smallerthan a supply amount of the gas supply unit also when the transportmechanism moves toward the first wall in the first proximal area.
 7. Thesubstrate transporting device according to claim 1, wherein the givendirection is a horizontal direction.
 8. The substrate transportingdevice according to claim 1, wherein the given direction is a verticaldirection.
 9. The substrate transporting device according to claim 1,wherein the transport chamber is disposed adjacent to a mount table thatplaces a substrate container thereon that accommodates the substrates,and the transport mechanism transports the substrates individually tothe substrate container placed on the mount table through thetransportation ports.
 10. A substrate treating apparatus, comprising:the substrate transporting device of claim 1; and a treating unit thatperforms treatment to the substrate.
 11. A substrate transportingdevice, comprising: a transport mechanism that is movable in parallel ina given direction and transports a substrate; and a transport chamberthat accommodates the transport mechanism, the transport chambercomprising: a first wall disposed on a first side of the given directionof the transport mechanism; and a plurality of transportation ports eachused for moving the substrate between an exterior and an interior of thetransport chamber, the substrate transporting device further comprising:a first exhaust unit that is disposed closer to the first wall than anyof the transportation ports, and exhausts gas in the transport chamberoutside the transport chamber, and a controller that controls thetransport mechanism and the first exhaust unit, wherein the controllerperforms control such that, when the transport mechanism is located in afirst proximal area whose distance from the first wall is of a givenvalue or less, holds no substrate, and moves toward the first wall, anexhaust amount of the first exhaust unit is larger than that when thetransport mechanism is located out of the first proximal area and movestoward the first wall.
 12. The substrate transporting device accordingto claim 11, wherein the first exhaust unit exhausts at least an amountof gas pushed out by the transport mechanism when the transportmechanism moves toward the first wall in the first proximal area. 13.The substrate transporting device according to claim 11, wherein thefirst exhaust unit is disposed on the first wall, and is disposed lowerin level than the transportation ports.
 14. The substrate transportingdevice according to claim 11, wherein the first proximal area is definedso as to contain the transport mechanism when the transport mechanismtransports the substrate to one of the transportation ports that is theclosest to the first wall, and so as not to contain the transportmechanism when the transport mechanism transports the substrate to anyof the transportation ports other than the transportation port that isthe closest to the first wall.
 15. The substrate transporting deviceaccording to claim 11, wherein the controller performs control such thatthe transport chamber has a positive pressure also when the transportmechanism moves toward the first wall in the first proximal area. 16.The substrate transporting device according to claim 15, furthercomprising: a gas supply unit that supplies gas to the transportchamber, wherein the controller controls the gas supply unit, and thecontroller performs control such that an exhaust amount of the firstexhaust unit is smaller than a supply amount of the gas supply unit alsowhen the transport mechanism moves toward the first wall in the firstproximal area.
 17. The substrate transporting device according to claim11, wherein the given direction is a horizontal direction.
 18. Thesubstrate transporting device according to claim 11, wherein the givendirection is a vertical direction.
 19. The substrate transporting deviceaccording to claim 11, wherein the transport chamber is disposedadjacent to a mount table that places a substrate container thereon thataccommodates the substrates, and the transport mechanism transports thesubstrates individually to the substrate container placed on the mounttable through the transportation ports.
 20. A substrate treatingapparatus, comprising: the substrate transporting device of claim 11;and a treating unit that performs treatment to the substrate.